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DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC8179TB
SILICON MMIC LOW CURRENT AMPLIFIER FOR MOBILE COMMUNICATIONS
DESCRIPTION
The PC8179TB is a silicon monolithic integrated circuit designed as amplifier for mobile communications. This IC can realize low current consumption with external chip inductor which can not be realized on internal 50 wideband matched IC. This low current amplifier operates on 3.0 V. This IC is manufactured using NEC's 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. This process uses direct silicon nitride passivation film and gold electrodes. These materials can protect the chip surface from pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
* Low current consumption * Supply voltage * High efficiency : ICC = 4.0 mA TYP. @ VCC = 3.0 V : VCC = 2.4 to 3.3 V : PO (1 dB) = +3.0 dBm TYP. @ f = 1.0 GHz PO (1 dB) = +1.5 dBm TYP. @ f = 1.9 GHz PO (1 dB) = +1.0 dBm TYP. @ f = 2.4 GHz * Power gain : GP = 13.5 dB TYP. @ f = 1.0 GHz GP = 15.5 dB TYP. @ f = 1.9 GHz GP = 15.5 dB TYP. @ f = 2.4 GHz * Excellent isolation : ISL = 44 dB TYP. @ f = 1.0 GHz ISL = 42 dB TYP. @ f = 1.9 GHz ISL = 41 dB TYP. @ f = 2.4 GHz * Operating frequency * Light weight : 0.1 to 2.4 GHz (Output port LC matching) : 7 mg (Standard value) * High-density surface mounting : 6-pin super minimold package (2.0 x 1.25 x 0.9 mm)
APPLICATION
* Buffer amplifiers on 0.1 to 2.4 GHz mobile communications system
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P14730EJ2V0DS00 (2nd edition) Date Published August 2000 N CP(K) Printed in Japan
(c)
2000
PC8179TB
ORDERING INFORMATION
Part Number Package 6-pin super minimold Marking C3C Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face the perforation side of the tape. Qty 3 kpcs/reel.
PC8179TB-E3
Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC8179TB)
PIN CONNECTIONS
(Top View) 3 2 1 (Bottom View) 4 5 6 4 5 6 3 2 1
Pin No. 1 2 3 4 5 6
Pin Name INPUT GND GND OUTPUT GND VCC
2
C3C
Data Sheet P14730EJ2V0DS00
PC8179TB
PRODUCT LINE-UP (TA = +25 C, VCC = Vout = 3.0 V, ZS = ZL = 50 )
Parameter 1.0 GHz output port matching frequency ICC (mA) 1.9 4.0 2.8 4.2 5.6 GP (dB) 11 13.5 12.5 12.5 23 ISL (dB) 39 44 39 38 40 PO(1 dB) (dBm) -4.0 +3.0 -4.0 +2.5 -4.5 1.66 GHz output port matching frequency GP (dB) - - 13 15 19.5 ISL (dB) - - 39 36 38 PO(1 dB) (dBm) - - -4.0 +1.5 -8.5 1.9 GHz output port matching frequency GP (dB) 11.5 15.5 13 15 17.5 ISL (dB) 40 42 37 34 35 PO(1 dB) (dBm) -7.0 +1.5 -4.0 +0.5 -8.5 2.4 GHz output port matching frequency GP (dB) 11.5 15.5 - - - ISL (dB) 38 41 - - - PO(1 dB) (dBm) -7.5 +1.0 - - - C3B C3C C2P C2U C2V Marking
Part No.
PC8178TB PC8179TB PC8128TB PC8151TB PC8152TB
Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
SYSTEM APPLICATION EXAMPLE
Location examples in digital cellular
Low Noise Tr. RX DEMOD. I Q
SW
/N
PLL PLL
I 0 TX PA
90 Q
These ICs can be added to your system around V parts, when you need more isolation or gain. The application herein, however, shows only examples, therefore the application can depend on your kit evaluation.
Data Sheet P14730EJ2V0DS00
3
PC8179TB
PIN EXPLANATION
Applied Voltage (V) - Pin Voltage Note (V) 1.09
Pin No. 1
Pin Name INPUT
Function and Applications
Internal Equivalent Circuit
Signal input pin. A internal matching circuit, configured with resisters, enables 50 connection over a wide band. This pin must be coupled to signal source with capacitor for DC cut.
2 3 5
GND
0
-
Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance defference.
6 4
4
OUTPUT
voltage as same as VCC through external inductor
-
Signal output pin. This pin is designed as collector output. Due to the high impedance output, this pin should be externally equipped with LC matching circuit to next stage. For L, a size 1005 chip inductor can be chosen.
2
3
1
5
6
VCC
2.4 to 3.3
-
Power supply pin. This pin should be externally equipped with bypass capacitor to minimize its impedance.
Note Pin voltage is measured at VCC = 3.0 V.
4
Data Sheet P14730EJ2V0DS00
PC8179TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Circuit Current Power Dissipation Symbol VCC ICC PD Conditions TA = +25 C, Pin 4, Pin 6 TA = +25 C Mounted on double sided copper clad 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85 C) Ratings 3.6 15 270 -40 to +85 -55 to +150 TA = +25 C +5 Unit V mA mW
Operating Ambient Temperature Storage Temperature Input Power
TA Tstg Pin
C C dBm
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Symbol VCC MIN. 2.4 -40 TYP. 3.0 MAX. 3.3 Unit V Remarks The same voltage should be applied to pin 4 and pin 6.
Operating Ambient Temperature
TA
+25
+85
C
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 C, VCC = Vout = 3.0 V, ZS = ZL = 50 , at LC matched frequency)
Parameter Circuit Current Power Gain Symbol ICC GP No signal f = 1.0 GHz, Pin = -30 dBm f = 1.9 GHz, Pin = -30 dBm f = 2.4 GHz, Pin = -30 dBm f = 1.0 GHz, Pin = -30 dBm f = 1.9 GHz, Pin = -30 dBm f = 2.4 GHz, Pin = -30 dBm f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz f = 1.9 GHz f = 2.4 GHz f = 1.0 GHz, Pin = -30 dBm f = 1.9 GHz, Pin = -30 dBm f = 2.4 GHz, Pin = -30 dBm Conditions MIN. 2.9 11.0 13.0 13.0 39 37 36 -0.5 -2.0 -3.0 - - - 4 4 6 TYP. 4.0 13.5 15.5 15.5 44 42 41 +3.0 +1.5 +1.0 5.0 5.0 5.0 7 7 9 MAX. 5.4 15.5 17.5 17.5 - - - - - - 6.5 6.5 6.5 - - - Unit mA dB
Isolation
ISL
dB
1 dB Gain Compression Output Power
Po(1dB)
dBm
Noise Figure
NF
dB
Input Return Loss (Without matching circuit)
RLin
dB
Data Sheet P14730EJ2V0DS00
5
PC8179TB
TEST CIRCUITS
<1> f = 1.0 GHz
VCC
C3
Output port matching circuit 6 50 IN C1 1 4 L1 C2 50 OUT
2, 3, 5
<2> f = 1.9 GHz
VCC
C4 C5
C6
Output port matching circuit 6 50 IN C1 1 4 L1 C2 C3 50 OUT
2, 3, 5
<3> f = 2.4 GHz
VCC
C3 C4
C5
Output port matching circuit 6 50 IN C1 1 4 L2 L1 50 OUT C2
2, 3, 5
6
Data Sheet P14730EJ2V0DS00
PC8179TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
<1> f = 1.0 GHz
Top View OUT
C3C
IN Connector
C1 C3
Mounting direction
COMPONENT LIST
1.0 GHz Output Port Matching C1 C2 C3 L1 1 000 pF 0.75 pF 10 pF 12 nH
Data Sheet P14730EJ2V0DS00
AMP-4
C2
Connector
L1
7
PC8179TB
<2> f = 1.9 GHz
Top View OUT
C3C
IN Connector
C1 C4
Mounting direction
C5
COMPONENT LIST
1.9 GHz Output Port Matching C1, C3, C5, C6 C2 C4 L1 1 000 pF 0.75 pF 10 pF 3.3 nH
8
Data Sheet P14730EJ2V0DS00
AMP-4
C2 C3
Connector
L1
C6
PC8179TB
<3> f = 2.4 GHz
Top View OUT
C3C
IN Connector
C1 C3
Mounting direction
COMPONENT LIST
2.4 GHz Output Port Matching C1, C2, C4, C5 C3 L1 L2 1 000 pF 10 pF 1.8 nH 2.7 nH
NOTES (1) 42 x 35 x 0.4 mm double sided copper clad polyimide board (2) Solder plated on pattern (3) Back side: GND pattern (4) : Through holes
Data Sheet P14730EJ2V0DS00
AMP-4
L2 C2 C5
Connector
L1
C4
9
PC8179TB
TYPICAL CHARACTERISTICS (unless otherwise specified, TA = +25C)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE 5 No signals
Circuit Current ICC (mA) Circuit Current ICC (mA)
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 5 No signals VCC = 3.0 V 4
4
3
3
2
2
1
1
0
0
2 3 1 Supply Voltage VCC (V)
4
0 -60 -40 -20 0 +20 +40 +60 +80 +100 Operating Ambient Temperature TA (C)
10
Data Sheet P14730EJ2V0DS00
PC8179TB
1.0 GHz OUTPUT PORT MATCHING S-PARAMETER (monitored at connector on board)
TA = +25C, VCC = Vout = 3.0 V
S11 1: 73.629 -61.461 2.5895 pF
1 000.000 000 MHz
MARKER 1 1 GHz
1
START 100.000 000 MHz
STOP 3 100.000 000 MHz
S22
1:
50.812
20.338
3.2369 nH
1 000.000 000 MHz
MARKER 1 1 GHz
1
START 100.000 000 MHz
STOP 3 100.000 000 MHz
Data Sheet P14730EJ2V0DS00
11
PC8179TB
1.0 GHz OUTPUT PORT MATCHING
POWER GAIN vs. FREQUENCY +20 VCC = 3.3 V +10
Power Gain GP (dB) Power Gain GP (dB)
POWER GAIN vs. FREQUENCY +20 +10 0 TA = +25C -10 -20 -30 -40 0.1 TA = +85C VCC = 3.0 V TA = -40C
0 VCC = 3.0 V -10 -20 -30 -40 0.1 VCC = 2.4 V
1.0 0.3 Frequency f (GHz)
3.0
1.0 0.3 Frequency f (GHz)
3.0
ISOLATION vs. FREQUENCY -10 -20
Isolation ISL (dB) Isolation ISL (dB)
ISOLATION vs. FREQUENCY -10 -20 -30 TA = -40C -40 -50 -60 TA = +85C -70 0.1 TA = +25C VCC = 3.0 V
-30 -40 -50 -60 -70 0.1 VCC = 2.4 V VCC = 3.0 V VCC = 3.3 V
1.0 0.3 Frequency f (GHz)
3.0
1.0 0.3 Frequency f (GHz)
3.0
INPUT RETURN LOSS vs. FREQUENCY 0 VCC = 2.4 V
Input Return Loss RLin (dB)
INPUT RETURN LOSS vs. FREQUENCY 0
Input Return Loss RLin (dB)
VCC = 3.0 V TA = +85C
-5 -10 VCC = 3.0 V -15 VCC = 3.3 V -20 -25 -30 0.1
-5 -10
TA = +25C -15 -20 -25 -30 0.1 TA = -40C
1.0 0.3 Frequency f (GHz)
3.0
1.0 0.3 Frequency f (GHz)
3.0
12
Data Sheet P14730EJ2V0DS00
PC8179TB
1.0 GHz OUTPUT PORT MATCHING
OUTPUT RETURN LOSS vs. FREQUENCY +5
Output Return Loss RLout (dB) Output Return Loss RLout (dB)
OUTPUT RETURN LOSS vs. FREQUENCY +5 0 -5 -10 -15 -20 -25 0.1 TA = -40C TA = +25C TA = +85C VCC = 3.0 V
0 -5 -10 -15 -20 -25 0.1 VCC = 2.4 V VCC = 3.0 V VCC = 3.3 V
1.0 0.3 Frequency f (GHz)
3.0
1.0 0.3 Frequency f (GHz)
3.0
OUTPUT POWER vs. INPUT POWER +10 VCC = 3.3 V +5
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER +10 VCC = 3.0 V +5
Output Power Pout (dBm)
0 -5 -10 -15 -20 -25
VCC = 3.0 V VCC = 2.4 V
TA = -40C 0 TA = +85C -5 -10 -15 -20 -25 TA = +25C
-30 -40 -35 -30 -25 -20 -15 -10 -5 Input Power Pin (dBm)
0
+5
-30 -40 -35 -30 -25 -20 -15 -10 -5 Input Power Pin (dBm)
0
+5
3rd Order Intermodulation Distortion IM3 (dBm) Output Power of Each Tone Pout(each) (dBm)
-10 -20 -30 -40 -50 -60 -70 -80 0 -40 -35 -30 -25 -20 -15 -10 -5 Input Power of Each Tone Pin(each) (dBm) IM3 Pout(each)
3rd Order Intermodulation Distortion IM3 (dBc)
3RD ORDER INTERMODULATION DISTORTION, OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE +20 +10 VCC = 3.0 V f1 = 1 000 MHz 0 f2 = 1 001 MHz
3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 60 VCC = 3.3 V f1 = 1 000 MHz f2 = 1 001 MHz 50 40 VCC = 2.4 V 30 20 10 0 -20 VCC = 3.0 V
+5 -15 0 -10 -5 Output Power of Each Tone Pout(each) (dBm)
Data Sheet P14730EJ2V0DS00
13
PC8179TB
1.0 GHz OUTPUT PORT MATCHING
NOISE FIGURE vs. SUPPLY VOLTAGE 6.0 TA = +85C 5.5 Noise Figure NF (dB) 5.0 4.5 4.0 TA = -40C 3.5 3.0 2.0 TA = +25C
3.0 2.5 Supply Voltage VCC (V)
3.5
14
Data Sheet P14730EJ2V0DS00
PC8179TB
1.9 GHz OUTPUT PORT MATCHING S-PARAMETER (monitored at connector on board)
TA = +25C, VCC = Vout = 3.0 V
S11 1: 38.717 -48.486 1.7276 pF
1 900.000 000 MHz
MARKER 1 1.9 GHz
1
START 100.000 000 MHz
STOP 3 100.000 000 MHz
S22
1:
62.379
-6.1953
13.521 pF
1 900.000 000 MHz
MARKER 1 1.9 GHz
1
START 100.000 000 MHz
STOP 3 100.000 000 MHz
Data Sheet P14730EJ2V0DS00
15
PC8179TB
1.9 GHz OUTPUT PORT MATCHING
POWER GAIN vs. FREQUENCY +20 VCC = 3.3 V +10
Power Gain GP (dB)
POWER GAIN vs. FREQUENCY +20 +10
Power Gain GP (dB)
VCC = 3.0 V
TA = -40C TA = +25C
VCC = 3.0 V 0 -10 -20 -30 -40 0.1 VCC = 2.4 V
0 TA = +85C -10 -20 -30 -40 0.1
1.0 0.3 Frequency f (GHz)
3.0
1.0 0.3 Frequency f (GHz)
3.0
ISOLATION vs. FREQUENCY -10 -20
Isolation ISL (dB) Isolation ISL (dB)
ISOLATION vs. FREQUENCY -10 -20 -30 TA = +25C -40 -50 TA = +85C -60 -70 0.1 TA = -40C VCC = 3.0 V
-30 VCC = 3.3 V -40 -50 VCC = 2.4 V -60 -70 0.1 VCC = 3.0 V
1.0 0.3 Frequency f (GHz)
3.0
1.0 0.3 Frequency f (GHz)
3.0
INPUT RETURN LOSS vs. FREQUENCY 0 VCC = 2.4 V
Input Return Loss RLin (dB)
INPUT RETURN LOSS vs. FREQUENCY 0 TA = +85C
Input Return Loss RLin (dB)
-5 -10 -15 -20 -25 -30 0.1 VCC = 3.3 V VCC = 3.0 V
-5 TA = +25C -10 TA = -40C -15 -20 -25 VCC = 3.0 V -30 1.0 0.1 0.3 Frequency f (GHz)
1.0 0.3 Frequency f (GHz)
3.0
3.0
16
Data Sheet P14730EJ2V0DS00
PC8179TB
1.9 GHz OUTPUT PORT MATCHING
OUTPUT RETURN LOSS vs. FREQUENCY +5
Output Return Loss RLout (dB) Output Return Loss RLout (dB)
OUTPUT RETURN LOSS vs. FREQUENCY +5 VCC = 3.0 V 0 -5 -10 -15 -20 TA = -40C -25 0.1 1.0 0.3 Frequency f (GHz) 3.0 TA = +85C TA = +25C
0 -5 -10 -15 -20 -25 0.1
VCC = 3.3 V VCC = 3.0 V VCC = 2.4 V
1.0 0.3 Frequency f (GHz)
3.0
OUTPUT POWER vs. INPUT POWER +10 +5
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER +10 TA = -40C +5
Output Power Pout (dBm)
0 -5
VCC = 3.3 V
0 -5 -10 -15 -20 -25
TA = +25C
VCC = 3.0 V -10 -15 VCC = 2.4 V -20 -25 -30 -40 -35 -30 -25 -20 -15 -10 -5 Input Power Pin (dBm) 0 +5
TA = +85C
VCC = 3.0 V -30 +5 -40 -35 -30 -25 -20 -15 -10 -5 0 Input Power Pin (dBm)
3rd Order Intermodulation Distortion IM3 (dBm) Output Power of Each Tone Pout(each) (dBm)
+10 0 -10 -20 -30 -40 -50 -60 -70 VCC = 3.0 V f1 = 1 900 MHz f2 = 1 901 MHz IM3 Pout(each)
3rd Order Intermodulation Distortion IM3 (dBc)
3RD ORDER INTERMODULATION DISTORTION, OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE +20
3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 60 f1 = 1 900 MHz f2 = 1 901 MHz 50 40 VCC = 3.3 V 30 VCC = 2.4 V 20 10 0 -20 VCC = 3.0 V
-80 0 -40 -35 -30 -25 -20 -15 -10 -5 Input Power of Each Tone Pin(each) (dBm)
+5 -15 0 -10 -5 Output Power of Each Tone Pout(each) (dBm)
Data Sheet P14730EJ2V0DS00
17
PC8179TB
1.9 GHz OUTPUT PORT MATCHING
NOISE FIGURE vs. SUPPLY VOLTAGE 5.5 TA = +85C Noise Figure NF (dB) 5.0
4.5 TA = +25C 4.0
3.5
TA = -40C
3.0 2.0
3.0 2.5 Supply Voltage VCC (V)
3.5
18
Data Sheet P14730EJ2V0DS00
PC8179TB
2.4 GHz OUTPUT PORT MATCHING S-PARAMETER (monitored at connector on board)
TA = +25C, VCC = Vout = 3.0 V
S11 1: 31.709 -36.367 1.8235 pF
2 400.000 000 MHz
MARKER 1 2.4 GHz
1
START 100.000 000 MHz
STOP 3 100.000 000 MHz
S22
1:
41.473
8.8828
589.06 pH
2 400.000 000 MHz
1
START 100.000 000 MHz
STOP 3 100.000 000 MHz
Data Sheet P14730EJ2V0DS00
19
PC8179TB
2.4 GHz OUTPUT PORT MATCHING
POWER GAIN vs. FREQUENCY +20 VCC = 3.3 V +10
Power Gain GP (dB) Power Gain GP (dB)
POWER GAIN vs. FREQUENCY +20 +10 VCC = 3.0 V TA = -40C TA = +25C 0 -10 -20 TA = +85C -30 -40 0.1
VCC = 3.0 V 0 -10 -20 VCC = 2.4 V -30 -40 0.1
1.0 0.3 Frequency f (GHz)
3.0
1.0 0.3 Frequency f (GHz)
3.0
ISOLATION vs. FREQUENCY -10 -20
Isolation ISL (dB) Isolation ISL (dB)
ISOLATION vs. FREQUENCY -10 -20 VCC = 3.0 V
-30 -40 VCC = 3.0 V -50 -60
VCC = 3.3 V
-30 -40 TA = -40C -50 -60
TA = +25C
VCC = 2.4 V -70 0.1 1.0 0.3 Frequency f (GHz) 3.0 -70 0.1
TA = +85C 1.0 0.3 Frequency f (GHz) 3.0
INPUT RETURN LOSS vs. FREQUENCY 0 VCC = 2.4 V
Input Return Loss RLin (dB)
INPUT RETURN LOSS vs. FREQUENCY 0 TA = +85C
Input Return Loss RLin (dB)
-5 VCC = 3.0 V -10 VCC = 3.3 V -15 -20 -25 -30 0.1
-5 -10 TA = +25C -15 -20 -25 VCC = 3.0 V -30 1.0 0.1 0.3 Frequency f (GHz) TA = -40C
1.0 0.3 Frequency f (GHz)
3.0
3.0
20
Data Sheet P14730EJ2V0DS00
PC8179TB
2.4 GHz OUTPUT PORT MATCHING
OUTPUT RETURN LOSS vs. FREQUENCY +5 +5 VCC = 3.0 V OUTPUT RETURN LOSS vs. FREQUENCY
Output Return Loss RLout (dB)
Output Return Loss RLout (dB)
0 -5 -10 VCC = 2.4 V -15 -20 -25 0.1 VCC = 3.0 V VCC = 3.3 V
0 -5 -10 TA = +85C -15 -20 -25 0.1 TA = +25C TA = -40C 1.0 0.3 Frequency f (GHz) 3.0
1.0 0.3 Frequency f (GHz)
3.0
OUTPUT POWER vs. INPUT POWER +10 +5 VCC = 3.3 V 0 -5 VCC = 3.0 V -10 -15 VCC = 2.4 V -20 -25 -30 -40 -35 -30 -25 -20 -15 -10 -5 Input Power Pin (dBm) 0 +5 +10
OUTPUT POWER vs. INPUT POWER VCC = 3.0 V +5
Output Power Pout (dBm)
Output Power Pout (dBm)
0 -5 -10
TA = +25C
TA = -40C -15 -20 TA = +85C -25 -30 -40 -35 -30 -25 -20 -15 -10 -5 Input Power Pin (dBm) 0 +5
3rd Order Intermodulation Distortion IM3 (dBm) Output Power of Each Tone Pout(each) (dBm)
+10 0 -10 -20 -30 -40 -50 -60 -70 VCC = 3.0 V f1 = 2 400 MHz f2 = 2 401 MHz IM3 Pout(each)
3rd Order Intermodulation Distortion IM3 (dBc)
3RD ORDER INTERMODULATION DISTORTION, OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE +20
3RD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE 60 f1 = 2 400 MHz f2 = 2 401 MHz 50 VCC = 3.3 V 40 VCC = 3.0 V 30 20 VCC = 2.4 V 10 0 -20
-80 0 -40 -35 -30 -25 -20 -15 -10 -5 Input Power of Each Tone Pin(each) (dBm)
+5 -15 0 -10 -5 Output Power of Each Tone Pout(each) (dBm)
Data Sheet P14730EJ2V0DS00
21
PC8179TB
2.4 GHz OUTPUT PORT MATCHING
NOISE FIGURE vs. SUPPLY VOLTAGE 5.5 TA = +85C
Noise Figure NF (dB)
5.0
4.5 TA = +25C 4.0
3.5
TA = -40C
3.0 2.0
3.0 2.5 Supply Voltage VCC (V)
3.5
Remark The graphs indicate nominal characteristics.
22
Data Sheet P14730EJ2V0DS00
PC8179TB
S-PARAMETER (VCC = Vout = 3.0 V)
S11-FREQUENCY
0.1 G 1.0 G 2.0 G
3.0 G
S22-FREQUENCY
0.1 G 1.0 G 2.0 G
3.0 G
Data Sheet P14730EJ2V0DS00
23
PC8179TB
TYPICAL S-PARAMETER VALUES (TA = +25C)
VCC = Vout = 3.0 V, ICC = 4.0 mA
FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 MAG. 0.824 0.692 0.594 0.533 0.499 0.474 0.460 0.450 0.441 0.438 0.431 0.426 0.427 0.417 0.413 0.408 0.398 0.387 0.380 0.366 0.352 0.341 0.330 0.320 0.304 0.296 0.285 0.272 0.267 0.256 0.248 S11 ANG. -17.1 -25.9 -29.2 -30.7 -31.1 -32.0 -32.7 -34.0 -35.6 -37.7 -39.8 -42.0 -44.8 -48.1 -50.6 -54.6 -57.6 -61.6 -64.9 -69.1 -72.1 -75.6 -79.4 -82.4 -85.6 -88.2 -91.7 -94.3 -96.9 -99.5 -101.9 MAG. 1.181 1.181 1.247 1.370 1.514 1.677 1.885 2.050 2.237 2.460 2.627 2.772 2.965 3.123 3.199 3.351 3.345 3.403 3.361 3.375 3.350 3.304 3.347 3.325 3.275 3.284 3.283 3.224 3.333 3.251 3.381 S21 ANG. -177.7 -172.4 -167.4 -164.1 -162.4 -162.9 -163.8 -166.3 -169.2 -173.1 -177.3 178.4 173.2 168.0 161.8 156.8 151.2 145.5 140.9 136.3 132.3 127.9 124.8 121.2 117.3 113.7 111.0 106.5 104.3 101.1 96.0 MAG. 0.002 0.003 0.004 0.005 0.005 0.006 0.006 0.006 0.005 0.007 0.007 0.005 0.005 0.004 0.006 0.005 0.003 0.005 0.005 0.004 0.003 0.003 0.006 0.006 0.006 0.004 0.005 0.005 0.008 0.009 0.008 S12 ANG. 108.8 64.7 51.3 55.8 60.6 46.6 42.9 45.9 42.1 34.0 46.9 27.7 40.2 24.4 45.5 44.6 42.4 42.7 59.5 45.4 58.3 73.9 81.1 98.3 100.5 114.6 104.8 114.1 127.8 126.3 134.1 MAG. 0.996 0.986 0.980 0.965 0.958 0.950 0.941 0.935 0.929 0.918 0.914 0.903 0.895 0.891 0.884 0.877 0.867 0.861 0.859 0.852 0.846 0.847 0.839 0.839 0.838 0.834 0.830 0.831 0.837 0.831 0.833 S22 ANG. -2.4 -4.0 -5.8 -7.5 -8.6 -10.1 -11.2 -12.4 -13.8 -14.9 -16.0 -17.0 -18.3 -19.5 -20.4 -21.1 -22.1 -23.0 -24.4 -25.1 -25.9 -26.4 -27.4 -28.2 -29.1 -29.7 -30.6 -31.4 -32.0 -33.4 -34.0
24
Data Sheet P14730EJ2V0DS00
PC8179TB
PACKAGE DIMENSIONS
6 PIN SUPER MINIMOLD (UNIT: mm)
2.10.1 1.250.1
2.00.2
1.3
0.65
0.65
0.1 MIN.
0.90.1
0.7
0 to 0.1
0.15 +0.1 -0.05
0.2+0.1 -0.05
Data Sheet P14730EJ2V0DS00
25
PC8179TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The inductor (L) should be attached between output and VCC pins. The L and series capacitor (C) values should be adjusted for applied frequency to match impedance to next stage. (5) The DC capacitor must be attached to input pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative.
Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235C or below Time: 30 seconds or less (at 210C) Note Count: 3, Exposure limit: None Package peak temperature: 215C or below Time: 40 seconds or less (at 200C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
26
Data Sheet P14730EJ2V0DS00
PC8179TB
[MEMO]
Data Sheet P14730EJ2V0DS00
27
PC8179TB
ATTENTION
OBSERVE PRECAUTIONS FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
* The information in this document is current as of August, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above).
M8E 00. 4

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